Low melting point Solder paste in a Syringe with plunger and nozzle.

40g syringe of 179 deg cent solder paste 62% tin, 36% lead, and 2% silver. This is a quality product used in Surface mount circuit board assembly and repair. The silver being a metal slow to oxidise aids whetting (smoothly covering the metal) making a superior joint. Perfect for RSU's as the low flux content is less likely to force items apart as it boils Comes complete with handle and fine metal nozzle.